High Density Computing

High density computing, up to 4x more compute performance per footprint


The rapidly growing use of analytical forecasting systems, big data analysis, AI and deep learning requires higher efficiency, significant cost savings and significant reductions in the environmental impact of data centers. High Performance Computing (HPC) is an important tool to balance IT budget, productivity and efficiency. For this, the computing power per rack space must be increased considerably.

Traditional data centers typically only have 3-4 KW of power per rack, which limits the number of highly compact servers that can be built into a rack. For the sensible use of high-density computing, however, a permanent power output of at least 10 - 12 KW is required in order to accommodate three times the number of servers on the same footprint. The new processor generations also have significantly more cores, which means that the increased use of virtualization enables a further improvement in relational performance/footprint.

The use of GPUs such as Tesla V100 can provide further performance boost with a moderate increase in power consumption. Graphics processors are thus a core component of high-density computing

However, it must be borne in mind that high-density computing requires additional floor space and effort to provide higher performance racks and compensate for the required additional cooling capacity.

Advantages of High Density Computing


The advantages of a high-density data center include:

  • Lower total cost of ownership (TCO) and improve growth opportunities through significantly more efficient use of space. In the next few years, the volume of data to be processed will double or triple.
  • Increase efficiency by maximizing power and cooling to get the highest performance per footprint and energy consumption. High Density Data Center management tools are optimized for operating servers with maximum efficiency. High Density Compute maximizes both performance and cooling to get the most out of each footprint and reduce total cost of ownership. High-density data center management tools are optimized for operating servers with maximum efficiency.
  • Outstanding, flexible storage solutions (NVMe/SAS/SATA, HDD/SSD/DOM)
  • Continuous monitoring and control via remote management

High-density systems at a glance


High-density systems, more details

Configuration and assembly


This gives you the opportunity to customize and optimize your High Density System to your needs. If you are uncertain or do not know how to configure High Density systems, you can contact us at any time by request or phone. Our team helps you to find the optimal solution for your application.

To the inquiry form


Configure your system yourself


Do you want to configure your system yourself? Select the category that meets your needs and you will be directed to the configuration.



Additional information


If you need additional information about High Density systems, you can find a detailed description of each system by following the links below:


sysGen/SUPERMICRO SSG-6019P-ACR12L, bestehend aus:
Mainboard Super X11DDW-NT / 1U Rackmount CSE-802TS-R606WBP

  • High Density Storage
  • Object Storage 1U
  • Scale-out Storage
  • Ceph / Hadoop
  • Big Data Analytics
  1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots
  3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 slot
  4. 12 Hot-swap 3.5" SAS3/SATA3 drive bays 4 Hot-swap 2.5" NVMe/SATA drive bays
  5. 2x 10GBase-T ports via Intel C622
  6. IPMI 2.0 + KVM with Dedicated LAN
  7. 1 VGA, 4 USB 3.0 (rear)
  8. 600W Redundant Power Supplies Platinum Level Certified

zum Hersteller-Datenblatt
Sie haben keine Zeit (oder Lust), selber zu konfigurieren? Kein Problem, das übernehmen wir gern für Sie unter:
Formular für Server-Angebotsanforderung
€ 2.000,17 (€ 2.380,20 inkl. MwSt.)

Coming Soon


sysGen/SUPERMICRO 1029P-NMR36L, bestehend aus
Mainboard Super (?) / 1U Rackmount CSE-121M3-R1K62P

  • 576TB NVMe SSD Power in just 1U !!!

  • IOPS Intensive Storage App
  • Database App. (MySQL, Casandra)
  • Hyperconverged Infrastructure / Scale-out Architectures
  1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
  2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x4 slot
  4. 32 Hot-swap NGSFF drive bays, 4 hybrid PCI-E NGSFF or SATA3 M.2 drive bays
  5. 2x 10GBase-T LAN ports via Intel X550
  6. 8x Heavy duty 4cm counter-rotating fans with air shroud
  7. 1600W Redundant Power Supplies Titanium Level (96%)
zum Hersteller-Datenblatt

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