Server/Workstation by Application

• Mainstream, Entry Appliance
• Low Power, Cost effective

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series
2. Intel® C236 chipset
3. 2 Fixed 3.5" drive bay or 3x 2.5" drive option
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x8 AOC slot
6. 2 GbE ports with Intel® i210-AT, 1 Dedicated IPMI port
7. 1 VGA, 1 COM, 2 USB 2.0, 2 USB 3.0
8. 350W Platinum Level power supply

• Mainstream, Entry Appliance
• Low Power, Cost effective

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series
2. Intel® C232 chipset
3. 1x 3.5" Fixed drive bay or 2x 2.5" drive option
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x8 AOC slot
6. 2 GbE ports with Intel® i210-AT, 1 Dedicated IPMI port
7. 1 VGA, 1 COM, 2 USB 3.0, 2 USB 2.0
8. 200W Multi-output power supply

• SMB, Web hosting, File/Print
• Network-Centric, General Purpose
• Mainstream Domain Controller

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series
2. Intel® C236 chipset
3. 4 Hot-swap 3.5" SATA3 bays w/ RAID
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x8 (in x16) AOC slot
6. 4 GbE ports with Intel® i210-AT
7. Integrated IPMI 2.0 and KVM with Dedicated LAN
8. 1 VGA, 2 COM, 4 USB 3.0, 2 USB 2.0
9. 350W Platinum Level Power Supply

• Embedded, 7-year life cycle
• Industrial Automation amp Control
• Military Compact Server
• VOIP and Network Appliances
• Medical Applications

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors
2. Intel® Q170 Express chipset
3. 2 Fixed 2.5" drive bays
4. Up to 64GB Unbuffered Non-ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x16 (in x16 slot)
6. 1 GbE LAN w/ Intel® i210-AT, 1 GbE LAN w/ Intel® PHY i219LM
7. Integrated IPMI 2.0 and KVM with Dedicated LAN, vPro supported
8. 2 DP, 1 DVI-I, Intel HD Graphics, with 3 independent displays, VGA for BMC AST2400
9. 400W Platinum Level Power Supply + Optional 2nd redundant 400W Power supply or Battery Backup Unit

• Cold Storage
• Archiving, Mail/Finance, Security
• Scale-Out Density, VOD Delivery
• Low Power Efficiency Appliance

1. Intel® Xeon® processor D-1518, Single socket FCBGA 1667; 4-Core, 8 Threads, 35W
2. 12x 3.5" SAS2/SATA3 Hot-swap HDD bays
3. Expansion slot: 1x PCI-E 3.0 x8, M.2 PCIe 3.0 x4, M Key 2242/2280/ 22110, Mini-PCIe w/ mSATA support
4. Up to 128GB ECC RDIMM DDR4 2133MHz or 64GB ECC/non-ECC UDIMM in 4 sockets
5. Dual 10G SFP+ and dual 1GbE LAN
6. 1x 10/100/1000 management LAN port (IPMI 2.0)
7. 2x USB 3.0 ports (rear), 5x USB 2.0 ports (4 via headers, 1 Type A)
8. 5x 4cm middle fans
9. 400W High-efficiency redundant short depth Power Supplies

• Cold Storage
• Data Warehousing, Archiving
• Long Tail, Medical Records, Compliance Docs
• Low Power Efficiency Appliance

1. Intel® Pentium® processor D1508, Single socket FCBGA 1667; 2-Core, 4 Threads, 25W
2. 12x 3.5" SAS2/SATA3 Hot-swap HDD bays
3. Expansion slot: 1x PCI-E 3.0 x8, M.2 PCIe 3.0 x4, M Key 2242/2280/ 22110, Mini-PCIe w/ mSATA support
4. Up to 128GB ECC RDIMM DDR4 1866MHz or 64GB ECC/non-ECC UDIMM in 4 sockets
5. Dual 10G SFP+ and dual 1GbE LAN
6. 1x 10/100/1000 management LAN port (IPMI 2.0)
7. 2x USB 3.0 ports (rear), 5x USB 2.0 ports (4 via headers, 1 Type A)
8. 5x 4cm middle fans
9. 400W High-efficiency redundant short depth Power Supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2400MHz; 16 DIMM slots
3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot
4. Dual port 10GBase-T (Intel® X540), Intel® XL710 used for dedicated heartbeat between 2 nodes in SBB
5. 40 Hot-swap 2.5" dual port NVMe drive bays
6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
7. 5 high-performance 8cm PWM fans
8. 2000W Redundant Power Supplies Titanium Level (96%)

sysGen/SUPERMICRO Server SYS-5019S-M, includes:
Mainboard MBD-X11SSH-F / 1U Rackmount CSE-813MFTQC-350CB

• Cloud, Web hosting, File/Print
• High flexibility, Communication
• Mainstream, Light load VM

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series
2. Intel® C236 chipset
3. 4x 3.5" Hot-swap SATA3 bays w/ RAID; Optional 2x 2.5" Fixed drives internal
4. 2x DOM (Disk on Module) ports /w with built-in power
5. 1x M.2 connector
6. Up to 64GB Unbuffered ECC UDIMM DDR4 2133MHz; 4x DIMM slots
7. 1x PCI-E 3.0 x8 (in x16) AOC slot
8. 2x GbE ports with Intel® i210-AT
9. Integrated IPMI 2.0 and KVM with Dedicated LAN
10. 1x VGA, 2x COM, 4x USB 3.0, 2x USB 2.0
11. 350W Platinum Level Power Supply

• HA, Web hosting, File/Print
• Mission-Critical, Light load VM

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series
2. Intel® C236 chipset
3. 4 Hot-swap 3.5" SATA3 bays w/ RAID
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x8 (in x16) AOC slot
6. 2 GbE ports with Intel® i210-AT
7. Integrated IPMI 2.0 and KVM with Dedicated LAN
8. 1 VGA, 2 COM, 4 USB 3.0, 2 USB 2.0
9. 400W Redundant Platinum Power Supplies w/ BBP® option

• Virtual Hosted Desktop VHD
• Digital Recording System
• Media/Content Streaming Server
• Fast Transcoding for Web Streaming
• Support Intel Quick Sync Video
• Intel Iris Pro Graphics P580
• Up to 18 AVC streams or 8 HEVC
• streams at 1080p 30FPS

1. Single socket FCBGA 1440 supports Intel® Xeon® processor E3-1585 v5, 4-Core, 8 Threads, 65W
2. Intel® C236 chipset
3. 1x 3.5" or 4x 2.5" HDD
4. Up to 32GB Unbuffered ECC SO-DIMM DDR4 2133MHz; 2 DIMM slots
5. 1 PCI-E 3.0 x16, 1 Mini-PCIe with mSATA, 1 M.2 (M Key, 2242/2280)
6. 4 GbE w/ Intel i219LM, I210AT, I350AM2; shared IPMI 2.0 LAN (Intel I210AT)
7. 1 VGA, 1 COM, 4 USB 3.0 (rear)
8. 200W Low noise AC-DC Power Supply with PFC

• Compact Embedded Mini ITX Box
• Security Appliance
• Video Surveillance
• Digital Signage, Indoor Kiosk

1. Intel® Atom processor E3940, SoC, FCBGA 1296
2. System-on-Chip
3. 1x 2.5" internal drive bay
4. Up to 8GB Unbuffered non-ECC DDR3- 1866MHz SO-DIMM in 1 DIMM slot
5. M.2 PCIe 2.0 x2, M Key 2242/2280
6. Dual GbE LAN ports via Intel I210IT
7. 1 DP (DisplayPort), 1 HDMI, 1 VGA, 1 Intel® HD Graphics
8. 2 USB 3.0 (rear), 2 USB 2.0 (rear), 3 COM ports (1 rear, 2 headers), 1 SuperDOM
9. 1x 4cm high performance PWM fan
10. 60W DC power adapter

• Mainstream, WIO

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium®
2. Intel® C236 chipset
3. 4 Hot-swap 3.5" drive bays
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 Left Riser slot; 1 PCI-E 3.0 x4 (in x8 slot)
6. 2 GbE ports with Intel® i210-AT, 1 dedicated IPMI port
7. 1 VGA, 1 COM, 2 USB 3.0, 2 USB 2.0
8. 500W Redundant Platinum Level power supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2400MHz; 16 DIMM slots
3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot
4. Dual port 10GBase-T (Intel® X540), Intel® XL710 used for dedicated heartbeat between 2 nodes in SBB
5. 20 Hot-swap 2.5" dual port NVMe drive bays
6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
7. 5 high-performance 8cm PWM fans
8. 2000W Redundant Power Supplies Titanium Level (96%)

• Support VHD amp Quick Sync Video
• Iris Pro Optimizations GT4e Build-in

1. Single socket FCBGA 1440 supports Intel® Xeon® processor E3-1585L v5, 4-Core, 8 Threads, 45W
2. Intel® C236 chipset
3. 4x 3.5" Hot-swap SATA3 bays w/ RAID
4. Up to 64GB ECC Unbuffered SO-DIMM DDR4-2133MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x8 (in x16) AOC slot
6. 2x 1GbE ports with Intel® i350
7. Integrated IPMI 2.0 and KVM with Dedicated LAN
8. I/O ports: 1 VGA, 1 COM, 2 USB 3.0 (front/rear), USB 2.0
9. 400W Redundant Platinum Power Supplies w/ BBP® option

• Web Hosting, VM
• Application and Data Serving
• Database Applications

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors
2. Intel® C622 chipset
3. 4 Hot-swap 3.5" SATA3 bays w/ RAID
4. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots
5. 1 PCI-E 3.0 x16 slot
6. 2x 10GBase-T ports with Intel® X557
7. Integrated IPMI 2.0 and KVM with Dedicated LAN
8. 1 VGA, 2 COM, 4 USB 3.0, 2 USB 2.0
9. 400W Redundant Platinum Power Supplies w/ BBP® option

• Virtualization
• Cloud Computing
• High End Enterprise Server

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 (FH, 10.5"L)
4. 2x 10GBase-T LAN ports
5. 10 Hot-swap 2.5" Drive Bays; 10 NVMe (4 hybrid ports - optional SAS3 via AOC); 2 internal M.2 (1 SATA3, 1 NVMe); 1 M.2 NVMe port, Optional extra M.2 NVMe and SATA3 ports
6. 8 Heavy duty fans w/ optimal fan speed control
7. 1000W Redundant Power Supplies Titanium Level (96%)

• Corporate Database
• Database Processing amp Storage
• Enterprise Server
• HPC, Data Center
• iSCSI SAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays, 2 Optional Onboard NVMe M.2
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557
7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies Titanium Level (96%)

• Corporate Database
• Database Processing amp Storage
• Enterprise Server
• HPC, Data Center
• iSCSI SAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays; 2 Rear hot-swap 2.5" drive bays, 2 Optional Onboard NVMe M.2
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with Intel X557
7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies Titanium Level (96%)

• Corporate Database
• Database Processing amp Storage
• Enterprise Server
• HPC, Data Center
• iSCSI SAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. 36 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays; 2 Rear hot-swap 2.5" drive bays, 2 Optional Onboard NVMe M.2
5. Broadcom 3108 SAS3 AOC
6. 2x 10GBase-T LAN ports with Intel X557
7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies Titanium Level (96%)

• Corporate Database
• Database Processing amp Storage
• Enterprise Server
• HPC, Data Center
• iSCSI SAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. 36 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays; 2 Rear hot-swap 2.5" drive bays, 2 Optional Onboard NVMe M.2
5. Broadcom 3008 SAS3 AOC
6. 2x 10GBase-T LAN ports with Intel X557
7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card, 1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SATA3 or 6 Hot-swap 3.5" SATA3 + 2 NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. 2x 8cm 14k RPM middle fans
8. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)

• Virtualization
• Cloud Computing
• High End Enterprise Server

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0 x8 slots (1 LP, 1 internal LP)
4. 2 10G SFP+ Ethernet ports
5. 10 Hot-swap 2.5" drive bays: 10 SAS3/SATA3 ports via Expander and AOC; Optional M.2 NVMe and SATA3 ports
6. 8 heavy duty fans w/ optimal fan speed control
7. 750W Redundant Power Supplies Platinum Level (94%+)

• DB Processing amp Storage
• Data Center Applications
• Firewall Applications

1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡
2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
4. 4 Hot-swap 3.5" SATA3 drive bays, 1 slim DVD-ROM drive bay
5. 2x 10GBase-T ports with Intel X772 + X557
6. 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
7. 2 SuperDOM (Disk on Module) ports
8. 600W Multi Output Power Supply, Platinum Level High-efficiency

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card, 1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. SAS3 via Broadcom 3108, HW RAID
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)

• Web Server, Firewall Apps.
• Corporate-Wins, DNS, Print, Login
• Gateway, provisioning servers
• Compact Network Appliance
• Cloud Computing

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x8 (FHHL) slots, 2 PCI-E 3.0 x8 (LP) slots, 1 PCI-E 3.0 x16 for Add-on-Module (Support SAS3 Storage controller), 1 PCI-E 3.0 x4 NVMe M.2 slot
4. 8 Hot-swap 3.5" SAS/SATA drive bays with SGPIO, 2 Fixed 3.5" drive bays
5. 1 Slim DVD-ROM drive bay (optional)
6. 2x 1GbE LAN ports via Intel C621
7. 1 VGA, 4 USB 3.0 (rear)
8. M.2 support
9. 1000W Redundant Power Supplies Titanium Level (96% Efficiency)

• Embedded Networking Applications
• Network Security Appliance
• FireWall Applications
• Virtualization Server

1. Intel® Atom® processor C3858, Single socket FCBGA 1310
2. System on Chip
3. 2 fixed 2.5" drive bays (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.)
4. Up to 64GB Unbuffered ECC/non-ECC SO-DIMM, up to DDR4-2400MHz, in 4 DIMM slots
5. 1 PCI-E 3.0 x4 AOC slot (LP)
6. 2x 10GBase-T, 2x 10G SFP+, and 4x 1GbE LAN ports
7. VGA via BMC, 2 USB 3.0 ports
8. 2x 40mm chassis fans, passive CPU heat sink
9. 84W DC power adapter

• Supports up to 4 NVIDIA GPUs in 1U
• Support Active/Passive GPUs
• GPU health monitoring with
• Fan speed control

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16 (FHFL) slots, 2 PCI-E 3.0 x16 (LP) slots
4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays
5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe
6. 2x 10GBase-T LAN ports via Intel X540
7. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control
8. 2000W Redundant Power Supplies Titanium Level (96%)

• Supports up to 4 NVIDIA GPUs in 1U
• Support Active/Passive GPUs
• GPU health monitoring with
• Fan speed control

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
3. 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E 3.0 x16 (LP) and 1 PCI-E 3.0 x8 (LP)
4. 2 Hot-swap 2.5" U.2 NVMe drive bays, 2 Internal 2.5" SATA drive bays
5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe
6. 2x 10GBase-T LAN ports via Intel X540
7. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control
8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors
2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6 DIMM slots
3. 2 PCI-E 3.0 x16 slots (support double-width GPU), 1 PCI-E 3.0 x16 low-profile slot (center right)
4. 6 Hot-swap 2.5" SAS/SATA drive bays
5. 2x 10GBase-T LAN ports via Intel X550
6. 2 M.2 form factor 2280, supports both M.2 NVMe and SATA SSD
7. 8 Heavy duty 4cm counter-rotating 4cm fans with air shroud & optimal fan speed control
8. 1400W High-efficiency Power Supply Platinum Level (94%+)

sysGen/SUPERMICRO Server SYS-E200-9AP, includes:
Mainboard MBD-A2SDi-4C-HLN4F / Case CSE-E101F

• Virtualization Server
• Virtual-CPE White Box
• Entry-level Network Appliance

1. Intel® Atom® processor C3558, Single socket FCBGA 1310
2. System-on-Chip
3. 1x fixed 2.5" SSD bay
4. Up to 256GB ECC RDIMM DDR4 2400MHz or 64GB ECC/non-ECC UDIMM in 4 sockets
5. M.2 PCI-E 3.0 x2 and SATA, M Key 2242/2280
6. 4x GbE LAN ports with C3000 SoC, dedicated LAN for IPMI 2.0
7. VGA via BMC, 2x USB 2.0 ports
8. 2x 40mm chassis fans
9. 60W lockable power adapter

• IoT Gateway for Smart
• Factory/Building/Home
• Kiosk, Interactive info system
• Environmental Monitor

1. 7th Generation Intel® Core™ i7-7600U Processor; Single Socket FCBGA 1356
2. System-on-Chip
3. 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E
4. Up to 32GB Unbuffered Non-ECC SO-DIMM DDR4 2133MHz; 2 DIMM slots
5. Dual GbE LAN w/ Intel i219LM + i210IT
6. 4 COM (RS-232/422/485), 2 USB 3.0, 4 USB 2.0, 1 DIO via DB9
7. 1 Display Port, 1 HDMI port
8. Fanless design
9. Lockable 12V DC 60W power adapter

sysGen/SUPERMICRO Server SYS-E50-9AP, includes:
Mainboard MBD-A2SAP-H / Case CSE-E101

• A2SAP-H
• Commercial Appliance
• IP51 for water/dust proof

1. Intel® Atom® processor E3940 (9.5W, 4C) Single socket FCBGA 1296
2. System-on-Chip
3. 1 SATA 3.0 for 7mm 2.5" SATA SSD, 1 M.2 B-Key 2242/3042 for SATA SSD
4. Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket
5. 1 Full size Mini-PCIe, 1 Half size Mini-PCIe, 1 M.2 B-Key 2242/3042, 1 M.2 E-Key 2230
6. Dual LAN with Intel I210-IT
7. 2 USB 3.0, 2 USB 2.0, 2 COM (RS-232/422/485), 1 TPM 2.0 onboard
8. Fanless design
9. Lockable 12V DC 40W power adapter

• Mainstream, WIO

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium®
2. Intel® C236 chipset
3. 4 Hot-swap 3.5" drive bays
4. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots
5. 1 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8
6. 4x 10GBase-T ports with Intel® X540, 1 dedicated IPMI port
7. 1 VGA, 1 COM, 2 USB 3.0, 2 USB 2.0
8. 500W Redundant Platinum Level power supplies

• Connectivity/Storage Compute Nodes
• Database Processing & Storage Appliance Platform

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors
2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
4. 2x 10GBase-T with Intel® X557
5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional)
6. SAS3 via Broadcom 3008 controller
7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
8. 7 High-performance 8cm PWM fans
9. 1200W Redundant Power Supplies Titanium Level (96%)

• Compute Intensive Application
• HPC, Data Center, Enterprise Server
• Hyperscale / Hyperconverged

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
4. IPMI 2.0 + KVM with dedicated LAN
5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support
6. SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
7. Video via Aspeed AST2500 BMC
8. 4 Heavy duty 8cm PWM fans with air shroud
9. 2200W Redundant Power Supplies Titanium Level (96%)

• Up to 4 NVIDIA Tesla V100 SXM2 GPUs
• Up to 300 GB/s GPU-to-GPU
• NVIDIA NVLINK
• Optimized for NVIDIA GPUDirect RDMA

1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16 slots
4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays
5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe
6. 2x 10GBase-T LAN ports via Intel X540
7. 7 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control
8. 2000W Redundant Power Supplies Titanium Level (96%)

• Supports up to 3 GPUs in 1U
• Support Passive GPUs
• 2D/3D and CAD Applications
• Astrophysics, Chemistry
• Cloud and Virtualization

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 4 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (in x16, LP) slots
4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SAS/SATA/NVMe drive bays
5. 1 SIOMfor flexible Networking
6. 10 Counter rotating fans with optimal fan speed control
7. 1600W Redundant Power Supplies Platinum Level (94%)

• Artificial Intelligence
• Big Data Analytics
• High-performance Computing
• Research Lab/National Lab
• Astrophysics, Business Intelligence

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray)
4. Support 8 Tesla V100 with 300GB/s NVLINK
5. Dual 10GBase-T LAN with Intel® X540
6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD
7. 8x 92mm cooling fans
8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card, 1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
7. SAS3 via Broadcom 3008
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)